As Hardware Technology gets advanced day by day more number of sophisticated methods of fixing the components in the PCB & the way of compacting the electronic system by advance methods like VLSI etc.,. Thus it is necessary that each and every component of an electronic components is of high quality and standards. Each and every component is to be studied for reliability while manufacturing and also while attaching it with the Mating components like PCB’s etc.,. The electronic components are subjected to high temperature while operation as well as in the manufacturing cycle. In this process the component is attached with the PCB by plasting moulding process. The objective is to study the stress levels in plastic package after cooling down from 175°C to 25°C. So to study the stresses induced in this process in study state and also in transient thermal analysis. In the first step a Transient thermal analysis is carried out to study the temperature distribution when 350W heat dissipated at top 5 um depth using the loading graph. In the second step Static structural analysis carried out to find the stresses using the transient thermal analysis results as input.
